HEX-S5.10.60- Series parallel motion platform  six free motion stages

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HEX-S5.10.60- Series parallel motion platform six free motion stages

Short Description:

6-axis Integrated Compound Motion, Multi-Dimension Synchronous Control

Integrate 6 degrees of freedom including XY translation, θX/θY tilt, Z vertical lift and unlimited 360° θZ rotation. A single unit realizes planar shift, vertical displacement, multi-angle deflection and full-circle rotation simultaneously. Smooth decoupled motion control enables complex spatial posture adjustment. It replaces stacked single-axis stages and greatly reduces equipment footprint.

The six-degree-of-freedom parallel motion design makes it more compact and rigid than a series motion system, with a greater dynamic range and no moving cables: more stable and less friction

 

 

 


Product Detail

Specification

Product Tags

 

 

  1. Hierarchical High-Precision Drive, Nano-Level Positioning Performance
  • Linear axes (XY/Z) adopt linear motors with 4.88nm high-resolution linear encoders, minimum incremental motion 100nm, repeatability ±0.2~±0.3μm, absolute positioning accuracy ±1μm;
  • Tilt axes (θX/θY) driven by stepper motors, angular resolution 0.3arcsec, repeatability ±1arcsec;
  • θZ rotary axis equipped with direct-drive motor for continuous 360° rotation, minimum angular step 0.1arcsec, repeatability ±1arcsec, angular positioning error ±5arcsec.

    All axes feature ultra-high feedback resolution, perfectly matching precision alignment and micro/sub-micron assembly processes.

  1. High-Speed & Stable Dynamic Performance

    Max speed: 100mm/s for XY, 15mm/s for Z, 30deg/sec for tilt axes, up to 4rps for rotation axis. High-rigidity parallel truss structure eliminates vibration and lag during high-speed movement, balancing fast throughput and positioning stability.

  2. Standard Large Travel + Full-Circle Rotation Layout

    Travel range: ±30mm (XY), ±5mm (Z), ±2.5° (θX/θY tilt), unlimited 360° θZ rotation, covering most adjustment ranges required for optical alignment, chip packaging and precision inspection. The top plate is pre-drilled with standard 8×M6 mounting holes and a central φ100 through hole for fast installation of fixtures, optical lenses and tooling.

  3. High Load Capacity & Compact Body

    Total unit weight 12kg, standard horizontal payload 10kg. Compact outline dimension (294.26×260mm, height 165.84mm). Parallel mechanism delivers superior rigidity compared to serial stacked stages with strong anti-deformation capability. Vertical mounting and customized travel/payload versions are available for diverse integration.

  4. Lab-Grade Calibrated Precision from Factory

    All accuracy parameters are calibrated under constant-temperature laboratory ideal conditions with dedicated motion controllers to guarantee rated performance. Customization on travel range, payload, outline size and motor configuration is supported.

1. Semiconductor & Microelectronics Industry
6D alignment for die bonder & packaging: High-precision pick-and-place of wafers, LED, Mini/Micro LED chips with micron-level angular and planar compensation;
Lithography stage & mask calibration bench: Multi-dimensional micro posture adjustment to meet sub-micron alignment demands of lithography optical paths;
Prober precision carrier stage: 6-DOF posture correction during electrical testing of chips to improve probe contact uniformity.
2. Optics, Laser & Precision Metrology
Optical lens coupling & fiber alignment: Multi-channel optical device coupling and 6-axis coaxial calibration for lens modules;
Laser processing auxiliary stage for galvo scanners: Real-time workpiece posture compensation for laser cutting, marking and micro-fabrication;
Test bench for interferometers & spectrometers: Precise multi-angle & multi-dimensional posture tuning for optical components;
Machine vision calibration & 3D inspection: Accurate 6-DOF alignment for cameras, lenses and test samples.
3. Precision Assembly & Automation Equipment
Automatic assembly of micro components: High-precision assembly of mobile camera modules, miniature bearings and sensor units;
New energy cell & electrode alignment: Micro error compensation for pouch cells and photovoltaic modules;
Medical device micro-part assembly: Calibration for endoscope lenses, microfluidic chips and medical sensors.
4. Laboratory Precision Scientific Instruments
Optical experiment & micro-nano manipulation stages for universities and research institutes;
Precision metrology fixtures for 3D surface scanning;
6-DOF posture adjustment platforms for bionic experiments and micro-mechanical testing.
5. Aerospace Precision Calibration
Ground simulation calibration bench for optical payloads and satellite lenses;
Ground posture simulation and accuracy verification for aerospace micro-components.

 

 

 

 

 


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  • Specifcation XY θXθY Z θZ
    Travel ±30mm ±2.5deg ±5mm 360deg
    Motor type linear motor step motor step motor Direct drive motor
    Opticval Encode resolution 4.88nm(1vpp) 4.88nm(1vpp) 4.88nm(1vpp) 0.04sec
    Minimum step size 100nm 0.3sec 100nm 0.1sec
    Repeatability ±0.2um ±1sec ±0.3um ±1sec
    Positioning accuracy ±1um ±5sec ±1um ±5sec
    Maximum speed [mm/s] 100mm/s 30deg/sec 15mm/s 4rps
    Maximum load [kg] The horizontal load is 10kg. Please contact the manufacturer for vertical load.
    Max mass The whole  weight is 12kg

     

     

     

     

     

     

     

     

     

     

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